Power Dissipation (Note 6)

Molded DIP (N) 1365 mW

Supply Voltage 25V

Voltage on Output Drivers 25V

Input Signal Overvoltage (Note 4) ±35V

Divider Voltage ?100 mV to V+

Reference Load Current 10 mA

Storage Temperature Range ?55°C to +150°C

Soldering Information

Dual-In-Line Package

Soldering (10 seconds) 260°C

Plastic Chip Carrier Package

Vapor Phase (60 seconds) 215°C

Infrared (15 seconds) 220°C

See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering

surface mount devices.